High-voltage electronics are the backbone of modern infrastructure, from electric vehicle powertrains to wind farms and data centers. As these systems scale, engineers face a persistent and often invisible challenge: condensation-induced corrosion. According to the Centre for Electronic Corrosion (CELCORR) at the Technical University of Denmark (DTU), roughly 50 percent of electronic failures currently lack a definitive root cause, often because moisture evaporates without leaving visible traces of damage unless dendrite formation occurs.
To address this, researchers are turning to multiphysics simulation to identify failure points before they manifest in the field. By creating digital models of printed circuit boards (PCBs), engineers can now predict how humidity, electrode spacing, and surface geometries influence electrochemical migration and leakage currents. This proactive design approach aims to bolster the reliability of power electronics in harsh climates where moisture ingress can trigger catastrophic malfunctions, including electrical fires.
The Hidden Impact of Humidity on High-Voltage Systems
The transition toward widespread automotive electrification and renewable energy has increased the reliance on high-power systems that must operate in diverse environmental conditions. Dr. Rajan Ambat, a professor at DTU and manager of CELCORR, notes that moisture is a primary driver of failure across the energy chain. When ambient humidity penetrates protective casings, it can form a conductive film on electronic surfaces. If the voltage is high enough, this film facilitates electrochemical migration—a process where metal ions move across the surface, eventually forming dendrites that cause short circuits.
“There might be a situation where somebody installs a solar panel near the seashore or in an area with high humidity, and within a short period of time, a conducive condition forms inside the electronics that results in a failure,” Ambat stated. Without an obvious sign of moisture damage, these failures are frequently misdiagnosed, leaving the underlying design flaw uncorrected. CELCORR’s research emphasizes that understanding the exact conditions under which condensation forms is critical to preventing these unexpected, and often costly, operational shutdowns.
Predictive Modeling as a Design Tool
To move beyond reactive troubleshooting, the research team at DTU, in collaboration with partners such as Aalborg University, utilizes COMSOL Multiphysics software to virtually test PCB designs. By simulating a 10-micrometer water film on a PCB surface, researchers can calculate electrochemical leak currents under various parameters. This process allows engineers to iterate on designs by adjusting electrode layout, geometry, and material conductivity before physical prototypes are even manufactured.
Dr. Anish Rao Lakkaraju, a postdoctoral researcher at CELCORR, describes the group’s work as a bridge between materials science and electrical engineering. By inputting real-world variables into these models, the team can identify which design elements offer the best anticorrosion robustness. This methodology provides a quantitative basis for determining whether a specific PCB layout will withstand the humidity loads expected in its intended operating environment.
Bridging Industry Needs with Simulation Apps
A significant hurdle in adopting advanced simulation is the complexity of the software itself. To overcome this, the CELCORR team used the Application Builder in COMSOL Multiphysics to develop simplified, user-friendly simulation apps for their industrial partners. These tools offer a “plug-and-play” interface that allows engineers to manipulate key variables—such as electrode distance and moisture layer thickness—without needing to be experts in the underlying multiphysics equations.
These apps enable companies to experiment with different design combinations in a digital environment, a task that would be prohibitively time-consuming or expensive to replicate through physical testing. By providing this level of design freedom, the research group helps industrial partners build electronics that are inherently more resistant to climate-related degradation.
Future Directions in Climate-Robust Design
The research scope at DTU is expanding, with the team currently refining their models to include more granular data, such as mass transport properties and chemical reaction rate constants. These efforts are designed to improve the accuracy of predictions for high-power, high-voltage systems, which are increasingly vital for the global energy transition. In 2024, the establishment of the Centre for Climate Robust Electronics Design (CRED), supported by a grant from the Grundfos Foundation, marked a major step in formalizing these research efforts.
The center’s mission is to address the specific humidity-robustness requirements of modern high-voltage equipment. As the industry continues to push the limits of power density and range, the ability to design for environmental longevity will remain a priority. CELCORR continues to iterate on its models, ensuring that the next generation of power electronics is built to withstand the realities of the climate, rather than just laboratory conditions. Industry stakeholders can look toward future publications from CRED as the center deepens its investigation into the chemical mechanisms of corrosion in high-voltage applications.